KIYOSU, Japan--(BUSINESS WIRE)--Toyoda Gosei Co., Ltd. (TOKYO: 7282), together with Osaka University, has succeeded in increasing the diameter of substrates for gallium nitride (GaN) power devices 1.

TAIPEI, Taiwan — Packaging services provider Advanced Semiconductor Engineering Inc. and PCB maker Compeq Manufacturing Co. Ltd. announced Tuesday (October 28, 2003) that they would set up a joint ...

Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...

The Global Electronics Association has published a new international standard, IPC‑6921, establishing formal requirements and acceptance criteria for organic integrated circuit (IC) substrates used in ...

The big picture: Taiwan's E&R Engineering is fully committing to glass substrates for advanced packaging. Late last month, the company hosted an event in Taipei to launch its new "E-Core System" ...

Glass substrates could be the key to linking up massive multi-chiplet processors of the near(ish) future. When you purchase through links on our site, we may earn an affiliate commission. Here’s how ...

Traditionally employed to make light-emitting diodes (LEDs), sapphire substrates now are being used by Apple Inc. and other smartphone makers as covers for camera lenses and home buttons, contributing ...

Intel says that using glass substrates for chips instead of organic materials should allow for even more transistors to be packed into the same space, but we will have to wait a while for these chips.