As computers get smaller and more powerful, engineers have begun exploring the potential of placing computers at the edge of networks, closer to the machinery and equipment being monitored and managed ...

Techcet Group, LLC reports the market for interconnect metals and dielectric materials, totaling $350 million in 2007, is maintaining its lead as the highest growth area compared to other ...

Heterogeneous integration is driving innovation in the semiconductor industry, but it also introduces more complexity in chip design, which translates to more intricate test requirements. The ...

Enterprises want seamless integration between their software as a service (SaaS) and on-premise applications. They have similar expectations for B2B integration scenarios that involve multi-enterprise ...